OMCL-AC240TS-R3
OMCL-AC240TS-,
标准型(Standard Silicon Cantilever)
Tip Schematic

• 1. Small spring constant for the measurements of soft samples
• 2. Measuring surface potential with low resistivity silicon

• 3. Ideally point terminated probe
• 4. Acclaimed ‘TipView’ structure
• 5. Reflex side aluminum coating
• 6. Ease in chip handling: ‘New concept chip’
• 7. Packaging: Pre-separated chips

More about New OMCL-AC240 series
1. Small spring constant for the measurements of soft samples
Spring constant of 2 N/m(Typ.) is the smallest in our silicon cantilevers for AC mode, suitable for observing surface topography and viscoelasticity of soft samples.

2. Measuring surface potential with low resistivity silicon
Cantilever base material employs N-type doped silicon with a surface resistance of 0.01-0.02 Ω · cm (1/200th the surface resistance of our other base materials). This can be achieved to use for measuring surface potential and other applications.
3. Ideally point terminated probe
The apex of the tetrahedral probe is ideally point terminated.
The tetrahedral probe shows good symmetry viewed from the front. Considering the geometric feature, choose the fast scan (X) direction. Check Scan line profile and enlarged view of the tip apex.
  

Patterned Sapphire Substrate 9 µm x 9 µm
Sample, courtesy of MAXIS, Korea
4. Acclaimed ‘TipView’ structure
The probe can be easily positioned at the exact point of your interest due to ‘TipView’ structure.
The probe is located at the exact end of the cantilever so that the probe apex is not obscured during optical observations.
      

5. Reflex side aluminum coating
Thin aluminum film with the thickness of 100 nm is coated on the cantilever for reflecting light from the deflection sensor in the AFM equipment. High reflex for high S/N sensing can be expected.
6. Ease in chip handling: ‘New concept chip’
The ideally vertical side-walls of the chip make tweezing easy and eliminate problems with chipping and debris.

3D-AFM 显微照片及其相应的 ( a ) Ni-P、Ni-P-TiC 复合涂层的表面粗糙度曲线( b ) 0.5 g L -1 , ( c ) 1.0 g L -1 , ( d ) 1.5 g L -1和( e ) 2.0g L -1 TiC颗粒。

含不同浓度 TiC 颗粒的 Ni-P 和 Ni-P-TiC 复合涂层的纳米压痕结果；( a ) 加载/卸载轮廓和 ( b ) 硬度。---OMCL-AC240TS-R3

8 nm 不同聚合物共混膜的 AFM 图像。

第一列是原始聚合物共混膜在用环己烷洗涤之前的 AFM 图像。为了去除共混膜中的PS，共混膜用环己烷洗涤。第二列显示了聚合物共混膜经环己烷洗涤后的 AFM 图像。第三列是沿着第一列和第二列中的线（灰线）的截面图。( a – c ), ( d–f ) 和 ( g – i ) 薄膜分别为 S20/M80、S50/M50 和 S80/M20。

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