真空气相焊接炉
Vapor phase soldering with Vacuum Condense-M
Highlight:
1️⃣数控喷射式注入传热媒介(气相液),精确控温,媲美对流式焊接的工艺曲线
Digitally control to inject heating-transfer media, precisely adjust temperature
2️⃣全密封工艺腔室,最理想真空环境下的静态焊接模式 Full-sealing static process chamber,guarantee optimal soldering quality
3️⃣可编程式真空控制系统,支持复杂电子产品、多层PCB
Programable controlling vacuum process, designed、DBC等的高可靠性焊接工艺
for high quality soldering
4️⃣极限真空压力可达2mbar
Mini. Vacuum pressure:2mbar
5️⃣助焊剂实时完全过滤,媒介(无损耗)循环利用 Real-time percolating flux residue,filtered medium can reuse, less waste