BTU Pyramax半导体封装炉
凭着卓越的温度和气氛控制能力，BTU Pyramax半导体封装炉是全球半导体封装制造商的首选，其优良的性能得到业界一致认同。
该系列炉广泛应用于SMT回流焊、半导体封装和固化等工艺，Air或N2气氛，最高运行温度400℃，完全满足无铅工艺需要。控温精度高±0.5℃，回流区网带横向温度均匀性±2℃，设备长期运行可靠性高，综合运营成本低，性价比高。
BTU’s Pyramax™ family of high-throughput thermal processing systems is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging.
Pyramax™ systems provide optimized lead-free processing for the ultimate in productivity and efficiency. BTU’s exclusive closed loop convection control provides precise heating and cooling, programmable heat transfer, and reduced nitrogen consumption, adding up to the lowest Cost of Ownership in the industry.
With 6, 8, 10 and new 12-zone air or nitrogen models, 350℃ maximum temperature and a comprehensive menu of options, Pyramax™ systems are the industry’s most versatile performers and best value.
BTU’s Pyramax™ family of products is backed by its industry leading comprehensive warranty:
- Lifetime on heaters and blowers;
- 3 years system;
- 1 year labor.
